スーパーコンピュータと先端パッケージング技術

ムーアの法則の減速により、スーパーコンピュータの性能向上にける先端パッケージングの重要性が増大している。本講演は日本の「富岳」をはじめとする世界トップクラスのスーパーコンピュータがどのようにパッケージング技術を活用しているかを紹介する。また、富岳の次に向けたプロジェクトとパッケージング技術への期待についても述べる。

Next IC Technology and 3D Heterogeneous Integration

Next wave of semiconductor is going to be two major trends, one is feature size scaling (more Moore) and the other is system scaling/heterogeneous integration (More than Moore). The presentation is to share the key aspects of future applications in semiconductor era “Three Highs”: High frequency (Beyond 5G or 6G), High speed/HPC (AI chips or High performance computing) and High power applications. From ITRI’s perspective, we believe that the semiconductor IC will follow these “Three Highs” and keep the momentum to speed up the market-oriented research and development to fulfill the domain needs of smart living, quality of life and sustainable environment by adopting advanced semiconductor technology. We will share the up-to-date of results and development of WBG semiconductor(eg. GaN & SiC) as well as Si-based advance AI-related devices. All these chips will be further integrated into a module or small system by heterogeneous integration (side-by-side or 3D stacking).