Dec.11_9:30_宇宙と地球と半導体7.0 その1ー未来構想編

人類は地球から宇宙に飛び出す運命を背負っている。その理由は何か？　また、宇宙に進出することで人類とその生活にどのような変化を生み、どんな新しいテクノロジーを使って何を生み出していくのか？　宇宙への進出は人類のサステイナビリティに貢献するのか？ そんな人類と宇宙の関係の未来を考察したい。

As global computing demands scale exponentially—driven by artificial intelligence, high-performance computing, and edge intelligence—the semiconductor industry stands at a critical turning point. Traditional physical scaling alone can no longer sustain the performance and energy-efficiency gains required by next-generation applications. Unlocking future industries requires a fundamental shift toward advanced packaging, chiplets, and breakthrough device architectures. This talk explores how cutting-edge semiconductor innovations are creating new paradigms for computing systems. Central to this transition is heterogeneous integration, where IBM is leading a radical shift with its Direct Bridge Multi-Die (DBrM) architecture. By unifying main dies in a lateral configuration before incorporating compact silicon bridges, DBrM reverses the traditional integration sequence. This yields an exceptionally simple manufacturing flow with high reliability, dramatic cost reductions, and seamless compatibility with Co-Packaged Optics (CPO) to overcome interconnect bottlenecks. At the atomic scale, continuous logic scaling relies on revolutionary device architectures and manufacturing capabilities. We will highlight the evolution of Gate-All-Around (GAA) Nanosheet technology, Nanostack device architecture, and the pivotal role of High-Numerical Aperture (High-NA) EUV lithography in driving performance into the sub-2nm regime. Finally, this presentation outlines IBM’s strategic vision for future computing and semiconductor technologies. By orchestrating breakthrough device physics, novel chiplet architectures, and optical integration, IBM is laying the hardware foundation to power the transformative, AI-scale industries of tomorrow.