Dec.10_11:30_光電融合、シリコンフォトニクス 最前線

As AI infrastructure expands and data center architectures evolve, photonics is becoming a critical enabler of next-generation computing and networking performance. The industry is now moving beyond conventional optical transceivers toward a broader set of photonic technologies, including silicon photonics, advanced modulator materials, optical I/O, and co-packaged optics (CPO), all of which are reshaping the semiconductor and packaging landscape. In this session, Yole Group will present a market-driven view of how photonics is scaling to meet the demands of AI data centers and high-performance networks. Drawing on its latest analyses in Optical Transceivers, Silicon Photonics, and Co-Packaged Optics, Yole will highlight the market dynamics, technology inflection points, and industrial shifts that are expected to define the 2026–2028 period. The presentation will connect end-market demand, including AI clusters, bandwidth growth, power constraints, and system architecture transitions, with the underlying technology choices and supply-chain implications. Key topics will include platform selection, the emergence of new modulator materials, packaging and assembly strategies, ecosystem readiness, and the evolving roles of foundries, OSATs, equipment suppliers, and component makers. Attendees can expect clear insights into commercialization timelines, competitive positioning, supply-chain bottlenecks, and where value is likely to migrate across the photonics ecosystem as next-generation optical technologies move toward scale.

コンピューティングシステムの電気配線の一部を光配線に置き換える光電融合が、半導体チップの近傍にまで入り込み始めた。AIデータセンターの電力問題を解決する省電力技術の1つになると期待される。半導体メーカーや通信機器メーカーが競う業界動向を総覧するとともに、日本の立ち位置と課題を議論する。