Dec.9_15:10_Global Semiconductor Leadership Summit 2

Artificial intelligence is driving unprecedented demand for computing capability while exposing the limits of traditional semiconductor scaling. As AI systems grow in size and complexity, future progress will depend not only on advances in transistor technology, but on overcoming system-level constraints related to energy consumption, power delivery, thermal management, memory capacity and bandwidth, and connectivity across increasingly distributed computing infrastructures. This presentation explores the industry's transition from transistor-driven scaling to system-driven scaling through the framework of Cross-Technology Co-Optimization (XTCO). By coordinating innovation across the entire computing stack, XTCO seeks to optimize five critical dimensions of AI systems: compute efficiency, power, thermal performance, memory density and bandwidth, and system fabric. Together, these dimensions increasingly determine the practical limits of AI performance, scalability, and cost. The talk will highlight how advances in advanced logic, chiplet architectures, 3D integration, advanced packaging, memory technologies, photonics, and emerging concepts such as CMOS 2.0 are enabling a new era of semiconductor innovation. It will conclude with perspectives on how ecosystem-wide collaboration and holistic optimization can continue to bend the curve of computing efficiency and sustain AI-driven growth in the decade ahead.

AIの進化により半導体需要は飛躍的に拡大する一方、生産性向上や環境負荷低減、人材不足といった新たな課題が生じている。 SCREENが約50年にわたり培ってきた洗浄技術をはじめとする中核技術の進化に加え、アドバンスドパッケージ分野、省エネを中心としたサステナビリティへの取り組みを紹介。 次の50年を支える製造イノベーションの方向性を展望する。

AIの普及に伴い、半導体デバイスはこれまで以上に高性能化・複雑化し、その開発サイクルは加速を続けると同時に、生産規模もかつてない水準へ拡大しています。このような変化の中で、半導体テストは単なる製造工程の一部ではなく、イノベーションと量産の加速を支える重要な基盤へと進化しつつあります。本講演では、Complexity、Velocity、Scaleという3つの視点から、先端パッケージ、テストセル、データ活用、テスト開発の自動化、そして大規模供給体制といった最新動向を紹介するとともに、半導体テスト市場が今後も成長を続ける構造的な背景と、アドバンテストの戦略的な取り組みについて説明します。

The artificial intelligence era is enabled by Angstrom-scale logic and memory technologies built in advanced 3D architectures. As the AI hypercycle accelerates demand for computing performance, semiconductor innovation is increasingly driven by materials engineering, atomic-scale precision, and the ability to manufacture ever more complex structures. Through its leadership in materials innovation and Angstrom-level process control, ASM is defining the next era of semiconductor technology.