Dec.9_12:50_Global Semiconductor Leadership Summit 1

The industry crosses a trillion dollars this year, but the story is no longer the build-out — it's the payoff. The fear that defined the early cycle (Cumulative AI capex racing ahead of revenue toward $5.5T by 2030) is easing because the enterprise buyer has arrived and agentic AI is moving from experimentation to production. As agents become the application, inference replaces training as the demand engine and usage grows faster than cost falls. The winners won't be whoever ships the most transistors, but whoever makes intelligence efficient, open, and deployable everywhere. Building partnerships across the ecosystem becomes essential to sustain growth. Join Mr. Morales as he shares his perspective on the key market dynamics in our industry and provides a strategic playbook on partnering with each other as it becomes the key recipe to win. #togetherweadvance.

生成AIを起点とするAI革命は、推論AI、エージェント型AI、フィジカルAIへと発展し、AIは、産業、モビリティ、日常生活を支える社会インフラへと進化しつつある。 キオクシアは本講演で、AIの社会実装に伴うデータの爆発的増加を支えるフラッシュメモリのパイオニアとして、技術開発・生産スケール・パートナーシップを通じた価値創造と成長戦略を紹介する。

AI Innovation has significantly increased the demand for advanced packaging solutions, which offer numerous benefits such as cost efficiency, design flexibility, and enhanced system performance. However, as AI product cycles accelerate toward an annual cadence, they present unprecedented challenges related to rapid development cycles, steep manufacturing ramps, and stringent system yield requirements. Therefore, ecosystem partnerships among chip designers, chiplet integrators, tool/material suppliers, HBM/substrate manufacturers, and system providers are essential to the continued advancement of packaging technologies for AI applications.