Dec.19_15:30_SCC Outlook and Progress ~Tackling Climate Change

This report details the activities of the Materials GHG Emissions Subgroup of the Japan Climate WG of SIPS (SEMI International Policy Summit). With participation from Japanese manufacturers of materials, components, equipment, and devices, this subgroup discussed GHG emissions from materials. We report on the findings examined from various perspectives: the proportion of GHG emissions from materials relative to total GHG emissions across the entire semiconductor supply chain (covering raw materials, manufacturing, and use); the potential for reducing total supply chain GHG emissions through material development; and the necessary steps moving forward.

This report details the activities of the Upstream Supply Chain Initiatives Subgroup of the Japan Climate WG of SIPS. Currently, collecting GHG emissions data from the upstream supply chain is not always straightforward, which presents a challenge for environmental initiatives across the entire supply chain. This report introduces the subgroup's practical solutions, including developing data collection mechanisms and collaborating with business partners.

This report details the activities of the Scope 3 Data Improvement Subgroup of the Japan Climate Working Group of SIPS. To understand the GHG emissions associated with semiconductor manufacturing, it is necessary to calculate the embodied GHG emissions of materials used in manufacturing processes, such as wafers, gases, and chemicals, which are classified under Scope 3, Category 1. Furthermore, refining these calculations requires examining the specific grades of materials for semiconductor manufacturing.

Scope 2 reduction is an urgent priority for all semiconductor players. This session focuses on Power Purchase Agreements (PPAs). We will breakdown all major PPA procurement schemes, showcase relevant case studies from Japan and share a framework on cost analysis and risk assessment.