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As economic security grows increasingly uncertain, semiconductors are becoming more important than ever. In Japan, industry, academia, and government are working together to revitalize the sector through research and development, production infrastructure, and talent cultivation. These efforts have led to outcomes such as mass production at domestic foundries and successful prototyping of 2nm transistors. This symposium will outline recent progress and future directions for sustainable growth.
*Please note that the program may be subject to change.
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With the emergence of edge AI devices, we are about to see a world with AI influencing the every aspect of life. In the light of challenges and opportunities they present for us, the presentation will introduce the strategic steps we are taking to smooth the path for this transition.
Since the mass production of SiC MOSFETs began in 2010, SiC power semiconductors have increasingly replaced conventional Si IGBTs in BEVs, railway traction, renewable energy systems, and AI servers, marking a new era in power electronics. Si-, SiC-, and GaN-based devices each offer distinct advantages for specific applications and are expected to coexist synergistically, forming a comprehensive “power semiconductor ecosystem.” This paper presents ROHM’s strategic approach to semiconductor development within this evolving domain.
Resonac, aiming to become a co-creation chemical company, has established the evaluation platform “JOINT2” in collaboration with materials, substrate, and equipment manufacturers, promoting the development of next-generation 2.5D and 2.xD packaging technologies. Furthermore, in 2025, the company launched a new co-creation platform “JOINT3” to enable large-scale interposer fabrication and full integration evaluation. This presentation will provide an overview of Resonac’s co-creation strategies
We will hear about semiconductor strategies from three global companies: Resonac Holdings, a leading Japanese semiconductor materials company; SCREEN Holdings, a semiconductor manufacturing equipment manufacturer; and Mitsui Fudosan, which is establishing an industrial development hub gathering semiconductor-related companies and research institutions. We will also introduce trends in cutting-edge semiconductor packaging, which is undergoing significant changes, such as the recently discussed chiplet integration and optoelectronic integration.
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