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Dec.18_14:30_Advanced Packaging and Chiplet Summit 2025

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Advanced Packaging and Chiplet Summit 2025

Chiplets Connecting the Future: Photonics, Mobility, and AI Shaping a Sustainable Society

Thursday, December 18 | 14:30 - 16:35
SuperTHEATER (West Hall 4)

Free

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In the three transformative domains that will support the future of society—photonics, mobility, and AI—this session will explore forward-looking initiatives aimed at achieving sustainability, share expectations for cutting-edge semiconductor and chiplet technologies, and discuss industry challenges and standardization directions from the perspectives of materials and equipment.

^{*Please note that the program may be subject to change.}

Program Agenda

14:30 - 14:55

Realizing a Sustainable Society Centered on Optical Technologies (IOWN)

Akiko Kudo

Representative Member of the Board, Senior Executive Vice President, CCXO

NTT DOCOMO BUSINESS

The IOWN initiative envisions a prosperous society empowered by cutting-edge optical technologies, including photonic-electronic convergence. This lecture will highlight the potential of IOWN within Japan’s social and industrial landscapes, and showcase NTT DOCOMO BUSINESS’s initiatives toward building a decentralized and autonomous society.

14:55 - 15:20

Development of Automotive Chiplet SoC in ASRA

Nobuaki Kawahara

Executive Director

ASRA

Automobiles are becoming increasingly intelligent and information-driven, leading to larger-scale onboard software and electronic systems. SoCs that control these systems in an integrated manner become more important. SoCs for Japanese cars vary widely in circuit scale and function. ASRA is developing these SoC by using chiplet technology.

15:20 - 15:45

Future Packaging/System Challenges for AI Data Centers

Babak Sabi

VP of Technology

AWS Annapurna Labs

In this presentation future packaging and system challenges for AI Data Center will be described. Potential solutions and research areas will be discussed.

15:45 - 16:35

Panel Discussion "Connecting the Future with Chiplets: Implementing Optical, Automotive, and AI Requirements through Advanced Packaging Technologies"