Dec.18_11:30_PFAS and Sustainability🌿

GHG emissions and PFAS alternatives are pivotal areas for sustainability efforts in chip manufacturing. In this presentation, Dr. Surésh Rajaraman, EVP and Head of Thin Films Business and interim Head of Formulations and Commercial Leadership Board, will highlight Merck's advancements in identifying alternatives to help solving GHG and PFAS related challenges of the semiconductor industry. We will provide updates on Merck's efforts to identify suitable candidates for PFAS replacement in various applications, such as fluorinated surfactants, EUV anti-collapse rinses, PAGs for chemically amplified photoresists across different wavelengths, and top anti-reflective coatings. And we will share insights into the development of alternative etch gases with significantly reduced atmospheric lifetime, which have the potential to replace traditional etch gases and help reducing GHG emissions in chip manufacturing. Additionally, we will discuss Merck's investment in the Advanced Materials Development Centre in Shizuoka, Japan, where it will explore alternative materials and technological solutions that support more sustainable manufacturing practices.

The semiconductor industry faces unprecedented materials challenges from tightening PFAS regulations, supply chain disruptions, and geopolitical pressures. IBM Material DX addresses these through comprehensive digital transformation, serving as a next-generation R&D platform for semiconductor and materials companies. The solution integrates dispersed data using advanced LLMs and foundation models to accelerate materials discovery and optimize R&D processes. Safe Material Advisor identifies legally risky substances like PFAS in products using AI trained on regulatory and chemical databases. Available on-premise or cloud-deployed to protect proprietary data, IBM Material DX positions companies at the global forefront of industrial innovation.

This report details the activities of the PFAS Identification Subgroup of the Japan PFAS WG of SIPS (SEMI International Policy Summit). The subgroup identified challenges in determining the types and locations of PFAS used or generated throughout the semiconductor manufacturing process and the lifecycle of facilities and manufacturing equipment. The report also outlines future efforts to address these challenges.

This report details the activities of the PFAS Recycling Scheme Subgroup of the Japan PFAS WG of SIPS. The subgroup drafts cross-industry initiatives concerning fluorine cycles and proposes the realization of a circular fluorine society. SIPS Japan WG has been working with the goal of demonstrating Japan's best practices to the global community. Specifically, this report covers recycling initiatives related to fluoropolymer materials.

This report details the activities of the PFAS Recovery and Destruction Subgroup of the Japan PFAS WG of SIPS. The report presents a non-exhaustive technical survey of PFAS recovery and destruction methods and assesses their feasibility. Additionally, the report outlines the characteristics and challenges of key technologies, provides an overview of prospects for practical implementation, and identifies future research topics.

The upcoming SEMI Europe presentation will outline the ongoing PFAS Restriction Process under the EU’s REACH regulation and its potential impact on the European semiconductor industry. It will explain how PFAS materials remain essential to chip manufacturing—used in photolithography, plasma etching, sealing, and coating applications—and why viable alternatives are not yet available. SEMI Europe will emphasize the need for a balanced, science-based approach, advocating for critical-use exemptions, realistic transition timelines, and continued dialogue with EU policymakers. The presentation will also highlight SEMI’s ongoing technical engagement and policy advocacy, aiming to ensure that Europe’s competitiveness and innovation capacity are safeguarded as the PFAS restriction process advances.