
Event Top
Translation Support Available
Please bring your own smartphone and earphones.
*Details will be provided in the FAQ.
As the convergence of photonics and electronics begins, this session explores the strategies, technologies, and ecosystems necessary to succeed in next-generation integrated systems. Industry leaders will share a comprehensive vision for the future of photonic-electronic integration, focusing on what to build, how to build it, and with what to build it.
*Please note that the program may be subject to change.
概要文が入ります。
Co-packaged optics (CPO) technology and Advanced Chiplet Packaging for artificial intelligence (AI) systems are driving high bandwidth density optics, high energy efficiency and compatibility of electronics and optics solutions. Challenges in technology for AI systems are continuing to accelerate CPO and photonics technology integration to support performance, lower cost, lower losses, high yield, repeatability and resilience in system applications. Next generations of hardware require increased numbers of waveguides, energy efficient Electrical-Optical-Electrical links also with high yield and reliability. This presentation will present updates on technology demonstrations and discuss next elements toward future CPO PDK and ADK for AI systems scaling.
The potential for optical devices to achieve low power consumption is extremely high. Semiconductor lasers have seen continuous improvements in compound semiconductor quality and have become widely adopted as light sources for communications. Throughout their development, Japan's optical semiconductor technology has played a globally significant role. These technologies also hold great promise for the future advancement of opto-electronic devices. This presentation will review their history and outline future prospects.