Dec.17_13:30_SATAS Program Summit (Back-End Process Standardization)

SATAS is a public-private research program with the Government of Japan to reimage and transform Assembly and Test manufacturing with innovative equipment, AMHS, smart manufacturing, and industry standards. SATAS is designed to enhance factory productivity, leading to domestic production, while enabling larger package sizes for AI era products. SATAS will develop, implement, and verify these technologies in an integrated pilot line located in Japan in 2027-2029.

SATAS aims not only to achieve full automation in semiconductor package assembly and testing processes but also to establish industry standards through the standardization of both physical and logical interfaces between the equipment necessary for such automation. In this part, I will introduce the vision and scope of standardization within SATAS.

Current semiconductor back-end processes involve many areas where automation and standardization are difficult, resulting in production systems requiring human intervention. This creates challenges such as labor shortages and skill succession. Panel packages, used in advanced packaging like chiplet integration, remain particularly difficult to achieve unified automated production lines. To address these challenges, we are researching the full automation and standardization of chiplet integration packages manufactured at the panel level. In this presentation, we report on our current progress and future plans.