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Dec.17_12:00_STS MEMS/Smart Sensing Device Session
STS MEMS/Smart Sensing Device Session
The Growing Role of Robotics: Powered by Sensor Fusion and MEMS
![STS](https://www.semiconjapan.org/sites/semiconjapan.org/files/styles/webp/public/inline-images/sts-hrzlogo_170.jpg.webp?itok=0YLqjsSa")
Wednesday, December 17 | 12:00 - 14:00
South Conference Room A-B / Online (Zoom)
Fee (Exclusive of tax)
| SEMI Members | Non-Members | Student | |
|
Early Bird (Sep17–Oct31) *Not Valid for Online |
8,000JPY | 16,000JPY | 4,000JPY |
| Regular Price (Nov1-) | 10,000JPY | 20,000JPY | 5,000JPY |
*Above fee includes "Download Presentation Materials" (some presentation materials might be written in Japanese)
- No cancellations, changes, or refunds will be accepted after application. Please check this link before applying.
- Please note that there are separate tickets for in-person and online participation, and also that the Early Bird tickets are available only for in-person applicants.
- For Student applicants, your Student Visitor Badge and student ID might be checked at the venue. Please refer to the “Student Registration” page before completing your registration.
The integration of 2D & 3D heterogeneous chips in semiconductor packages is an important technology. The development of interconnect technologies such as chip-to-chip & chip-to-wafer and microcircuit formation technologies for interposer and substrate is progressing. In this session, we will discuss new materials and new processes.
*Please note that the program may be subject to change.
Program Agenda
Session Chair:
Masahiko Takei (Fuji Electric)
Toshiyuki Takahashi (OMRON)
Kentaro Totsu (Tohoku University)
*In alphabetical order by company name
Boston Dynamics
Sensors are the foundation of modern robotic autonomy, transforming motion into perception, and perception into reliable, repeatable work in unstructured environments. This talk will unpack how multimodal sensing—vision, depth, inertial, proprioceptive, and application-specific payloads—enables robust navigation, inspection, and decision-making in industrial settings.
MITSUMI ELECTRIC
High-precision haptic sensing is essential for the evolution of humanoid robots. This session introduces the structure, operating principle, and design innovations of an ultra-compact, lightweight digital 6-axis force sensor suitable for integration into robot fingertips. We will discuss how this sensor enables advanced dexterity in robot hands and explore its future applications in robotics.
Nippon Signal
Robots use many sensors, including LiDAR, as a means of recognizing the outside world. In this presentation, I will explain the future of robotics by introducing examples of MEMS 3D LiDAR, which has been used in infrastructure for many years, and new robot applications such as multi-functional robot.
QDLaser
Laser retinal scanning projection technology is expected to lead to advances in AR smart glasses and the medical field.
This presentation will introduce how MEMS technology is being used as a key device in these applications.
It will also outline future prospects from the perspective of related component technologies and end products.
If you're interested, just stay in the venue after the seminar wraps up.