Dec.16_9:00_Strategic Materials Conference Japan 2025

China has rapidly advanced in semiconductor technology, now ranking second globally behind the United States, surpassing South Korea in key areas like AI chips, power semiconductors, and high-density storage . Despite U.S. export controls, China’s leading players have made significant breakthroughs. Foundries like SMIC have achieved stable 7nm production, while Yangtze Memory and CXMT are boosting domestic storage chip self-sufficiency. Chinese leading technology players are also making massive investments into AI and chips. Innovations like Chiplet packaging and carbon-based semiconductors further enhance performance while circumventing advanced node limitations . The emerging of leading China AI players has narrowed the gap with the U.S. Open-source pioneers like DeepSeek and Alibaba have demonstrated their commitment into AI training and reference. DeepSeek’s R1 model rivals OpenAI’s offerings, and China dominates in multimodal AI, achieving parity in text-to-image generation and nearing U.S. levels in video synthesis . Companies like ByteDance and Tencent leverage massive user data for refining models, while startups like Moonshot AI innovate in long-context processing . AI integration into industries—manufacturing, healthcare, and smart cities—showcases practical gains, such as predictive maintenance and AI-assisted diagnostics . Challenges persist, including EUV lithography dependency and high-end AI chip shortages . However, China’s "scenario-driven" approach, combining policy support, talent cultivation, and open-source collaboration, positions it to lead in scalable AI applications and next-gen semiconductors like quantum and photonic chips . This systematic progress underscores China’s transformative role in global tech.

半導体市場は生成AI向けデバイスの拡大により、外部環境が不透明ななかにあって金額ベースでの市場規模は安定した推移を示している。設備投資サイドでは2022年以降は中国が牽引、2026年以降は米国での半導体設備投資も増加が見込まれる。市場は安定しているなかにあってリスクも蓄積している。本講演では今後の半導体設備投資見通しおよびリスクについて俯瞰してみたい。

Silicon interposer technology has matured into a reliable and widely adopted solution for advanced semiconductor packaging. It enables high-density integration and efficient signal routing between chips. However, as chip sizes continue to grow, the traditional 12-inch round silicon wafers face limitations in terms of die yield and material utilization. The circular format often results in wasted silicon real estate, especially when accommodating rectangular device chips. To address this inefficiency, square or rectangular substrates—similar to glass panels—are being considered as a viable alternative to extend the lifecycle of silicon interposer technology. These formats align more closely with the shape of most semiconductor devices, potentially improving layout efficiency and reducing material waste. Despite their advantages, glass panels present several manufacturing challenges, including difficulties in through-via hole drilling, mechanical fragility, susceptibility to breakage, and risks of metal contamination. In contrast, silicon panel wafers offer a robust and compatible solution, mitigating many of these issues while supporting advanced packaging requirements. As packaging density increases, thermal management has become a critical concern. Efficient heat dissipation is essential to maintain device performance and reliability. To meet this need, various materials—particularly non-silicon and metallic compounds—have been explored. GlobalWafers Corporation (GWC) has successfully developed three types of silicon carbide (SiC) wafers: Single Crystal SiC, CVD Polycrystalline SiC, and Sintered Polycrystalline SiC. These materials are well-suited for thermal applications such as SiC interposers and heat sinks, offering superior thermal conductivity and mechanical strength.

先端ロジック・材料技術の進展に伴い後工程プロセスの革新が重要性を増している。特に高密度実装や多機能化を支える先進半導体パッケージング技術は性能向上の鍵を握る。本講演では先進的な半導体パッケージング技術の最新動向を紹介する。

近年の生成AI普及に伴い、特に推論用途を中心にストレージ市場は今後も拡大が見込まれています。当社では、高性能、大容量、低消費電力など多様化するストレージニーズに対応するため、競争優位性のあるBiCS FLASHTMの開発を進めています。技術動向に加え、デバイス性能由来の材料への期待など、その展望をお話しします。

・最近の世界の半導体市場動向と近年の特徴的な変化について ・半導体セクターにおけるFDIの概観、主要企業の動向、およびその動向に深く関わる主要国・地域の産業政策について ・経済安全保障に関わる輸出入関連規制や投資制限措置が、グローバル企業の貿易・投資戦略に与える影響について ・米国第2次トランプ政権の通商政策が今後の半導体サプライチェーンにもたらすリスクについて ・日本の半導体関連企業が直面する課題と将来展望について

大規模言語モデルや暗号資産等の拡大に伴う演算処理量の急速かつ大幅な増大を背景とした、半導体及び情報処理システムの低遅延化及び低消費電力化の両立に貢献する、我が国の半導体材料(EUV光源リソグラフィ関連材料や高密度実装関連材料等)の市場の変化等について考察する。